Display device having fracture resistance

ABSTRACT

A display device including a base member, a circuit layer, a display layer, a thin film encapsulation layer, and a touch sensor layer. The base member includes a first area and a second area disposed adjacent to the first area. The circuit layer is disposed on the base member to cover the first area and to expose the second area. The display layer is disposed on the circuit layer to display an image. The thin film encapsulation layer is disposed on the display layer. The touch sensor layer is disposed on the thin film encapsulation layer and includes an organic layer extending from an upper portion of the thin film encapsulation layer to cover at least a portion of the exposed second area.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of U.S. patent application Ser. No.16/379,796, filed on Apr. 10, 2019, which is a Continuation of U.S.patent application Ser. No. 15/654,485, filed on Jul. 19, 2017, issuedas U.S. Pat. No. 10,347,853, which claims priority from and the benefitof Korean Patent Application No. 10-2016-0097459, filed on Jul. 29,2016, each of which is hereby incorporated by reference for all purposesas if fully set forth herein.

BACKGROUND Field

Exemplary embodiments relate to a display device. More particularly, thepresent disclosure relates to a display device capable of preventing orreducing the occurrence of fractures in the device.

Discussion of the Background

Various display devices for a multimedia device, such as a televisionset, a mobile phone, a tablet computer, a navigation unit, a game unit,etc., have been developed. As an input device for the display devices, akeyboard or a mouse is widely used. In recent years, a touch panel isoften used as the input device of the display devices.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the inventive concept,and, therefore, it may contain information that does not form the priorart that is already known in this country to a person of ordinary skillin the art.

SUMMARY

Exemplary embodiments provide a display device capable of preventingfractures from occurring when the display device is bent or folded.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concept.

An exemplary embodiment of the present invention discloses a displaydevice including a base member, a circuit layer, a display layer, a thinfilm encapsulation layer, and a touch sensor layer. The base memberincludes a first area and a second area disposed adjacent to the firstarea. The circuit layer is disposed on the base member to cover thefirst area and to expose the second area. The display layer is disposedon the circuit layer to display an image. The thin film encapsulationlayer is disposed on the display layer. The touch sensor layer isdisposed on the thin film encapsulation layer and includes an organiclayer extending from an upper portion of the thin film encapsulationlayer to cover at least a portion of the exposed second area.

According to the above, fractures in the display device may be preventedwhen the device is bent or folded.

The foregoing general description and the following detailed descriptionare exemplary and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification, illustrate exemplaryembodiments of the inventive concept, and, together with thedescription, serve to explain principles of the inventive concept.

FIG. 1A is a perspective view showing a display device according to anexemplary embodiment of the present disclosure.

FIG. 1B is a cross-sectional view showing a display device according toan exemplary embodiment of the present disclosure.

FIG. 2A is a perspective view showing a display device according to anexemplary embodiment of the present disclosure.

FIG. 2B is a cross-sectional view showing a display device according toan exemplary embodiment of the present disclosure.

FIG. 3A and FIG. 3B are perspective views showing a display deviceaccording to an exemplary embodiment of the present disclosure.

FIG. 4A is a plan view showing an organic light emitting display panelaccording to an exemplary embodiment of the present disclosure.

FIG. 4B is a cross-sectional view showing a display module according toan exemplary embodiment of the present disclosure.

FIG. 5A is an equivalent circuit diagram showing a pixel according to anexemplary embodiment of the present disclosure.

FIG. 5B is a cross-sectional view showing a portion of an organic lightemitting display panel according to an exemplary embodiment of thepresent disclosure.

FIG. 5C is a cross-sectional view showing a portion of an organic lightemitting display panel according to an exemplary embodiment of thepresent disclosure.

FIG. 6A, FIG. 6B, and FIG. 6C are cross-sectional views showing thinfilm encapsulation layers according to an exemplary embodiment of thepresent disclosure.

FIG. 7A is a cross-sectional view showing a touch sensor layer accordingto an exemplary embodiment of the present disclosure.

FIG. 7B, FIG. 7C, FIG. 7D, and FIG. 7E are plan views showing a touchsensor layer according to an exemplary embodiment of the presentdisclosure.

FIG. 7F is a partially enlarged view showing an area BB of FIG. 7E.

FIG. 8A, FIG. 8B, FIG. 8C, and FIG. 8D are partially enlarged viewsshowing an area AA of FIG. 4B.

FIG. 9A, FIG. 9B, FIG. 9C, FIG. 9D, FIG. 9E, FIG. 9F, FIG. 9G, FIG. 9H,and FIG. 9I are cross-sectional views showing a method of manufacturinga display module shown in FIG. 8C.

DETAILED DESCRIPTION OF THE ILLUSTRATED EMBODIMENTS

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments. It is apparent, however,that various exemplary embodiments may be practiced without thesespecific details or with one or more equivalent arrangements. In otherinstances, well-known structures and devices are shown in block diagramform in order to avoid unnecessarily obscuring various exemplaryembodiments.

In the accompanying figures, the size and relative sizes of layers,films, panels, regions, etc., may be exaggerated for clarity anddescriptive purposes. Also, like reference numerals denote likeelements.

When an element or layer is referred to as being “on,” “connected to,”or “coupled to” another element or layer, it may be directly on,connected to, or coupled to the other element or layer or interveningelements or layers may be present. When, however, an element or layer isreferred to as being “directly on,” “directly connected to,” or“directly coupled to” another element or layer, there are no interveningelements or layers present. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. Like numbers refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

Although the terms first, second, etc. may be used herein to describevarious elements, components, regions, layers, and/or sections, theseelements, components, regions, layers, and/or sections should not belimited by these terms. These terms are used to distinguish one element,component, region, layer, and/or section from another element,component, region, layer, and/or section. Thus, a first element,component, region, layer, and/or section discussed below could be termeda second element, component, region, layer, and/or section withoutdeparting from the teachings of the present disclosure.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for descriptive purposes, and,thereby, to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the drawings. Spatiallyrelative terms are intended to encompass different orientations of anapparatus in use, operation, and/or manufacture in addition to theorientation depicted in the drawings. For example, if the apparatus inthe drawings is turned over, elements described as “below” or “beneath”other elements or features would then be oriented “above” the otherelements or features. Thus, the exemplary term “below” can encompassboth an orientation of above and below. Furthermore, the apparatus maybe otherwise oriented (e.g., rotated 90 degrees or at otherorientations), and, as such, the spatially relative descriptors usedherein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof.

Various exemplary embodiments are described herein with reference tosectional illustrations that are schematic illustrations of idealizedexemplary embodiments and/or intermediate structures. As such,variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. The regions illustrated in the drawings are schematic innature and their shapes are not intended to illustrate the actual shapeof a region of a device and are not intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, the present invention will be explained in detail withreference to the accompanying drawings.

FIG. 1A is a perspective view showing a display device DD according toan exemplary embodiment of the present disclosure.

Referring to FIG. 1A, the display device DD includes a plurality ofareas. The display device DD includes a display area DD-DA in which animage IM is displayed and a non-display area DD-NDA disposed adjacent tothe display area DD-DA. The image IM is not displayed in the non-displayarea DD-NDA. FIG. 1 shows an image of a vase as the image IM. Thedisplay area DD-DA has, for example, a substantially quadrangular shape,and the non-display area DD-NDA surrounds the display area DD-DA, butthe present invention is not limited thereto or thereby.

The display device DD has a shape in which a portion thereof is bent.For instance, as shown in FIG. 1A, the display device DD includes abending area BA having a bent shape and a non-bending area NBA having aflat shape. The bending area BA is disposed adjacent to at least oneside of the non-bending area NBA. According to another exemplaryembodiment, the bending area BA and the non-bending area NBA may beomitted.

The non-bending area NBA is substantially parallel to a surface definedby a first direction DR1 and a second direction DR2. A direction normalto the non-bending area NBA indicates a third direction DR3. In eachmember, a front surface is distinguished from a rear surface by thethird direction DR3. The bending area BA bent from the non-bending areaNBA displays the image WI to a fourth direction DR4 crossing the firstdirection DR1, the second direction DR2, and the third direction DR3.However, directions indicated by the first to fourth directions DR1 toDR4 are terms which are relative to each other, and thus, the first tofourth directions DR1 to DR4 may be changed to other directions.

FIG. 1B is a cross-sectional view showing the display device DD shown inFIG. 1A. FIG. 1B shows the cross-section defined by the first directionDR1 and the third direction DR3.

Referring to FIG. 1B, the display device DD includes a protective filmPM, a display module DM, an optical member LM, a window WM, a firstadhesive member AM1, a second adhesive member AM2, and a third adhesivemember AM3. The display module DM is disposed between the protectivefilm PM and the optical member LM. The optical member LM is disposedbetween the display module DM and the window WM. The first adhesivemember AM1 couples the display module DM and the protective film PM, thesecond adhesive member AM2 couples the display module DM and the opticalmember LM, and the third adhesive member AM3 couples the optical memberLM and the window WM.

The protective film PM protects the display module DM. The protectivefilm PM includes a first outer surface OS-L exposed to the outside andan adhesive surface adhered to the first adhesive member AM1. Theprotective film PM prevents external moisture from entering the displaymodule DM and absorbs external impacts.

The protective film PM may include a plastic film as a base substrate.The protective film PM may include the plastic film including oneselected from the group consisting of polyethersulfone (PES),polyacrylate (PAR), polyetherimide (PEI), polyethylenenaphthalate (PEN),polyethyleneterephthalate (PET), polyphenylenesulfide (PPS),polyarylate, polyimide (PI), polycarbonate (PC),poly(aryleneethersulfone), and a mixture thereof.

The material of the protective film PM may include a mixed material ofan organic material and an inorganic material without being limited tothe plastic resins. The protective film PM includes a porous organiclayer and an inorganic material filled in the pores of the organiclayer. The protective film PM may further include a functional layerformed in the plastic film. The functional layer includes a resin layer.The functional layer is formed by a coating method. In an exemplaryembodiment, the protective film PM may be omitted.

The window WM protects the display module DM from external impacts andprovides an input surface to a user. The window WM provides a secondouter surface OS-U exposed to the outside and an adhesive surfaceadhered to the third adhesive member AM3. The display surface IS shownin FIG. 1A may be the second outer surface OS-U shown in FIG. 1B.

The window WM may include a plastic film. The window WM may have amulti-layer structure, which may include a glass substrate, a plasticfilm, or a plastic substrate. The window WM may further include a bezelpattern. The multi-layer structure of the window WM may be formedthrough consecutive processes or an adhesive process using an adhesive.

The optical member LM reduces a reflectance of an external light. Theoptical member LM includes at least a polarizing film. The opticalmember LM further includes a retardation film. In the present exemplaryembodiment, the optical member LM may be omitted.

The display module DM includes an organic light emitting display panelDP and a touch sensor layer TS. The touch sensor layer TS is directlydisposed on the organic light emitting display panel DP. In thefollowing descriptions, the expression “a first component is directlydisposed on a second component” means that the first and secondcomponents are formed through consecutive processes without beingattached to each other by using a separate adhesive layer.

The organic light emitting display panel DP generates the image IM(refer to FIG. 1A) corresponding to image data input thereto. Theorganic light emitting display panel DP includes a first display panelsurface BS1-L and a second display panel surface BS1-U facing the firstdisplay panel surface BS1-L in the thickness direction DR3. In thepresent exemplary embodiment, the organic light emitting display panelDP will be described as a representative example of the display panel,but the display panel should not be limited to the organic lightemitting display panel.

The touch sensor layer TS obtains coordinates information of an externalinput. The touch sensor layer TS senses the external input in anelectrostatic capacitive manner.

Although not shown in the figures, the display module DM according tothe present exemplary embodiment may further include an anti-reflectionlayer. The anti-reflection layer may include a stack structure of acolor filter or a conductive layer/an insulating layer/a conductivelayer. The anti-reflection layer absorbs or polarizes the light from theoutside thereof to reduce the reflectance of the external light. Theanti-reflection layer may replace the function of the optical member LM.

Each of the first, second, and third adhesive members AM1, AM2, and AM3may be, but not limited to, an organic adhesive layer, such as anoptically clear adhesive film (OCA), an optically clear resin (OCR), ora pressure sensitive adhesive film (PSA). The organic adhesive layer mayinclude a polyurethane-based adhesive material, a polyacryl-basedadhesive material, a polyester-based adhesive material, a polyepoxy-based adhesive material, or a polyvinyl acetate-based adhesivematerial. Consequently, the organic adhesive layer may correspond to oneorganic layer.

Although not shown in figures, the display device DD may further includea frame structure supporting the functional layer to maintain the stateshown in FIGS. 1A and 1B. The frame structure may have a joint structureor a hinge structure.

The bending area BA of the display device DD may have a shape bent at apredetermined radius of curvature. Alternatively, the bending area BAmay have a shape bent such that the radius of curvature is reduced as adistance from the non-bending area NBA increases. However, the bendingarea BA may be bent at various radius of curvature.

In the present exemplary embodiment, at least one of the protective filmPM, the adhesive members AM1, AM2, and AM3, the optical member LM, andthe window WM may be omitted. The display device according to thepresent exemplary embodiment may include combinations of various membersand should not be limited to a specific structure.

FIG. 2A is a perspective view showing a display device DD-1 according toan exemplary embodiment of the present disclosure. FIG. 2B is across-sectional view showing the display device DD-1 according to anexemplary embodiment of the present disclosure. Hereinafter, the displaydevice DD-1 will be described in detail with reference to FIGS. 2A and2B. In FIGS. 2A and 2B, the same reference numerals denote the sameelements in FIGS. 1A and 1B, and thus, detailed descriptions of the sameelements will be omitted.

Referring to FIG. 2A, the display device DD-1 includes one non-bendingarea NBA, and first and second bending areas BA1 and BA2 disposed atopposite side surfaces of the non-bending area NBA. FIG. 2B shows thecross-section defined by the first and third directions DR1 and DR3.

The display device DD-1 includes the first bending area BA1 and thesecond bending area BA2. The first and second bending areas BA1 and BA2are defined to be spaced apart from each other such that the non-bendingarea NBA is disposed between the first and second bending areas BA1 andBA2. The first bending area BA1 is disposed adjacent to one side of thenon-bending area NBA and is bent to be convex toward the fourthdirection DR4. The second bending area BA2 is disposed adjacent to theother side of the non-bending area NBA and is bent to be convex towardthe fifth direction DR5.

The display device DD-1 has a substantially convex shape toward thethird direction DR3. Meanwhile, the display device DD-1 may have aconcave shape upward in accordance with the shape of each of the firstand second bending areas BA1 and BA2 according to exemplary embodiments.The display device DD-1 according to the present exemplary embodimentmay have various shapes and should not be limited to a specificembodiment.

Although FIGS. 1A to 2B show a bending display device as arepresentative example of the display devices DD and DD-1, the displaydevices DD and DD-1 may be a foldable display device or a rollabledisplay device. In addition, the present exemplary embodiment shows theflexible display device, but it should not be limited thereto orthereby. That is, the display device DD according to the presentexemplary embodiment may be a flat rigid display device or a curvedrigid display device. The display device DD according to the presentexemplary embodiment may be applied to a large-sized electronic item,such as a television set, a monitor, etc., and a small and medium-sizedelectronic item, such as a mobile phone, a tablet, automobilenavigation, a game unit, a smart watch, etc.

FIGS. 3A and 3B are perspective views showing a display device DD-2according to an exemplary embodiment of the present disclosure. FIG. 3Ashows the display device DD-2 in an unfolded state, and FIG. 3B showsthe display device DD-2 in a bent state.

The display device DD-2 includes one bending area BA and one non-bendingarea NBA. The non-display area DD-NDA of the display device DD-2 isbent. However, the bent area of the display device DD-2 may be changedin the present exemplary embodiment.

The display device DD-2 may be fixed in one state while being operated.The display device DD-2 may be operated in the bent state as shown inFIG. 3B. The display device DD-2 may be fixed to a frame while beingbent, and the frame may be coupled to a housing of an electronic device.

The display device DD-2 according to the present exemplary embodimentmay have substantially the same cross-sectional structure as that shownin FIG. 1B. However, the non-bending area NBA and the bending area BAmay have different stack structures from each other. For instance, thenon-bending area NBA may have substantially the same cross-sectionalstructure as that shown in FIG. 1B, and the bending area BA may have across-sectional structure different from that shown in FIG. 1B. Theoptical member LM and the window WM may not be disposed in the bendingarea BA. That is, the optical member LM and the window WM may bedisposed only in the non-bending area NBA. The second and third adhesivemembers AM2 and AM3 may not be disposed in the bending area BA. Asdescribed above, since at least one element among elements shown in FIG.1B may be overlapped with only the non-bending area NBA and may not beoverlapped with the bending area BA, the bending area BA may have arelatively small thickness when compared to that of the non-bending areaNBA. Accordingly, the bending area may be easily bent.

FIG. 4A is a plan view showing an organic light emitting display panelDP according to an exemplary embodiment of the present disclosure, andFIG. 4B is a cross-sectional view showing a display module DM accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 4A, the organic light emitting display panel DPincludes a display area DA and a non-display area NDA when viewed in aplan view. The display area DA and the non-display area NDA of theorganic light emitting display panel DP respectively correspond to thedisplay area DD-DA (refer to FIG. 1A) and the non-display area DD-NDA(refer to FIG. 1A) of the display device DD (refer to FIG. 1A). Thedisplay area DA and the non-display area NDA of the organic lightemitting display panel DP are not required to be identical to thedisplay area DD-DA (refer to FIG. 1A) and the non-display area DD-NDA(refer to FIG. 1A) of the display device DD (refer to FIG. 1A), and thedisplay area DA and the non-display area NDA of the organic lightemitting display panel DP may be changed in accordance with thestructure and design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality ofpixels PX. An area in which the pixels PX are arranged is referred to asthe display area DA. In the present exemplary embodiment, thenon-display area NDA is defined along an edge of the display area DA.

The organic light emitting display panel DP includes gate lines GL, datalines DL, light emitting lines EL, a control signal line SL-D, aninitialization voltage line SL-Vint, a voltage line SL-VDD, a powersupply line E-VSS, and a pad part PD.

Each of the gate lines GL is connected to a corresponding pixel of thepixels PX, and each of the data lines DL is connected to a correspondingpixel of the pixels PX. Each of the light emitting lines EL is arrangedto be substantially parallel to a corresponding gate line of the gatelines GL. The control signal line SL-D applies a control signal to agate driving circuit GDC. The initialization voltage line SL-Vintapplies an initialization voltage to the pixels PX. The voltage lineSL-VDD is connected to the pixels PX to apply a first voltage to thepixels PX. The voltage line SL-VDD includes a plurality of linesextending in the first direction DR1 and a plurality of lines extendingin the second direction DR2. The power supply line E-VSS is disposed inthe non-display area NDA to surround three sides of the display area DA.The power supply line E-VSS applies a common voltage (e.g., a secondvoltage) to the pixels PX. The common voltage has a level lower thanthat of the first voltage.

The gate driving circuit GDC is disposed at one side portion of thenon-display area NDA and connected to the gate lines GL and the lightemitting lines EL. Some of the gate lines GL, the data lines DL, thelight emitting lines EL, the control signal line SL-D, theinitialization voltage line SL-Vint, and the voltage line SL-VDD aredisposed on the same layer, and the others of the gate lines GL, thedata lines DL, the light emitting lines EL, the control signal lineSL-D, the initialization voltage line SL-Vint, and the voltage lineSL-VDD are disposed on different layers.

The pad part PD is connected to an end of the data lines DL, the controlsignal line SL-D, the initialization voltage line SL-Vint, and thevoltage line SL-VDD.

Referring to FIG. 4B, the organic light emitting display panel DPincludes a base member BSM, a circuit layer DP-CL disposed on the basemember BSM, a display layer DP-OLED, and a thin film encapsulation layerTFE.

The base member BSM includes at least one plastic film. The base memberBSM may be a flexible substrate and may include a plastic substrate, aglass substrate, a metal substrate, or an organic/inorganic-mixedmaterial substrate. The plastic substrate includes at least one of anacryl-based resin, a methacryl-based resin, polyisoprene, a vinyl-basedresin, an epoxy-based resin, a urethane-based resin, a cellulose-basedresin, a siloxane-based resin, a polyimide-based resin, apolyamide-based resin, and a perylene-based resin.

The circuit layer DP-CL includes a plurality of insulating layers, aplurality of conductive layers, and a semiconductor layer. Theconductive layers of the circuit layer DP-CL may form signal lines or acontrol circuit of the pixel.

The display layer DP-OLED includes a plurality of organic light emittingdiodes.

The thin film encapsulation layer TFE encapsulates the display layerDP-OLED. The thin film encapsulation layer TFE includes an inorganiclayer and an organic layer. The thin film encapsulation layer TFEincludes at least two inorganic layers and an organic layer disposedbetween them. The inorganic layers protect the display layer DP-OLEDfrom moisture and oxygen, and the organic layer protects the displaylayer DP-OLED from foreign substance, such as dust. The inorganic layermay include a silicon nitride layer, a silicon oxynitride layer, and asilicon oxide layer. The organic layer may include an acryl-basedorganic material, but it should not be limited thereto or thereby.

The touch sensor layer TS is directly disposed on the thin filmencapsulation layer TFE. The touch sensor layer TS includes touchsensors and touch signal lines. The touch sensors and the touch signallines have a singly-layer structure or a multi-layer structure.

The touch sensors and the touch signal lines may include indium tinoxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zincoxide (ITZO), PEDOT, a metal nano-wire, and a graphene. The touchsensors and the touch signal lines may include a metal layer, e.g.,molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. Thetouch sensors and the touch signal lines may have the same layerstructure or different layer structures. The touch sensor layer TS willbe described in detail later.

FIG. 5A is an equivalent circuit diagram showing a pixel according to anexemplary embodiment of the present disclosure.

FIG. 5A shows an i-th pixel PXi connected to a k-th data line DLk amongthe data lines DL (refer to FIG. 4A).

The i-th pixel PXi includes an organic light emitting diode OLED and apixel driving circuit controlling the organic light emitting diode OLED.The pixel driving circuit includes seven thin film transistors T1 to T7and one storage capacitor Cst. The driving thin film transistor T1controls a driving current applied to the organic light emitting diodeOLED. An output electrode of a second thin film transistor T2 iselectrically connected to the organic light emitting diode OLED. Theoutput electrode of the second thin film transistor T2 directly contactsa first electrode of the organic light emitting diode OLED or isconnected to the first electrode of the organic light emitting diodeOLED via another transistor, e.g., a sixth thin film transistor T6.

A control electrode of a control transistor receives a control signal.The control signal applied to the i-th pixel PXi includes an (i−1)thgate signal Si−1, an i-th gate signal Si, an (i+1)th gate signal Si+1, adata signal Dk, and an i-th light emitting control signal Ei. In thepresent exemplary embodiment, the control thin film transistor includesa first thin film transistor T1 and third to seventh thin filmtransistors T3 to T7.

The first thin film transistor T1 includes an input electrode connectedto the k-th data line DLk, a control electrode connected to an i-th gateline GLi, and an output electrode connected to the output electrode ofthe second thin film transistor T2. The first thin film transistor T1 isturned on by the gate signal Si (hereinafter, referred to as the “i-thgate signal”) applied to the i-th gate line GLi to apply the data signalDk applied to the k-th data line to the storage capacitor Cst.

FIG. 5B is a cross-sectional view showing a portion of an organic lightemitting display panel according to an exemplary embodiment of thepresent disclosure, and FIG. 5C is a cross-sectional view showing aportion of an organic light emitting display panel according to anexemplary embodiment of the present disclosure. In detail, FIG. 5B showsthe cross-section of the portion corresponding to the first thin filmtransistor T1 of the equivalent circuit shown in FIG. 5A, and FIG. 5Cshows the cross-section of the portion corresponding to the second thinfilm transistor T2, the sixth thin film transistor T6, and the organiclight emitting diode OLED of the equivalent circuit shown in FIG. 5A.

Referring to FIGS. 5B and 5C, a buffer layer BFL is disposed on the baselayer SUB. The buffer layer BFL improves a coupling force between thebase layer SUB and the conductive patterns or the semiconductorpatterns. The buffer layer BFL includes an inorganic layer. Although notshown in the figures, a barrier layer may be further disposed on thebase layer SUB to prevent foreign substances from entering. The bufferlayer BFL and the barrier layer may be selectively disposed or omitted.

A semiconductor pattern OSP1 (hereinafter, referred to as a “firstsemiconductor pattern”) of the first thin film transistor T1, asemiconductor pattern OSP2 (hereinafter, referred to as a “secondsemiconductor pattern”) of the second thin film transistor T2, and asemiconductor pattern OSP6 (hereinafter, referred to as a “sixthsemiconductor pattern) of the sixth thin film transistor T6 are disposedon the buffer layer BFL. The first semiconductor pattern OSP1, thesecond semiconductor pattern OSP2, and the sixth semiconductor patternOSP6 may include amorphous silicon, polysilicon, or metal oxidesemiconductor.

A first insulating layer 10 is disposed on the first semiconductorpattern OSP1, the second semiconductor pattern OSP2, and the sixthsemiconductor pattern OSP6. In FIGS. 5B and 5C, the first insulatinglayer 10 is provided in a layer form to cover the first semiconductorpattern OSP1, the second semiconductor pattern OSP2, and the sixthsemiconductor pattern OSP6, but the present invention should not belimited thereto or thereby. That is, the first insulating layer 10 maybe provided in pattern form corresponding to the first semiconductorpattern OSP1, the second semiconductor pattern OSP2, and the sixthsemiconductor pattern OSP6.

The first insulating layer 10 may include a plurality of inorganic thinlayers. The inorganic thin layers include the silicon nitride layer, thesilicon oxynitride layer, and the silicon oxide layer.

A control electrode GE1 (hereinafter, referred to as a “first controlelectrode”) of the first thin film transistor T1, a control electrodeGE2 (hereinafter, referred to as a “second control electrode”) of thesecond thin film transistor T2, a control electrode GE6 (hereinafter,referred to as a “sixth control electrode”) of the sixth thin filmtransistor T6 are disposed on the first insulating layer 10. The firstcontrol electrode GE1, the second control electrode GE2, and the sixthcontrol electrode GE6 are formed through the same photolithographyprocess as the gate lines GL (refer to FIG. 4A).

A second insulating layer 20 is disposed above the first insulatinglayer 10 to cover the first control electrode GE1, the second controlelectrode GE2, and the sixth control electrode GE6. The secondinsulating layer 20 provides a flat upper surface. The second insulatinglayer 20 includes an organic material and/or an inorganic material.

An input electrode SE1 (hereinafter, referred to as a “first inputelectrode”) and an output electrode DE1 (hereinafter, referred to as a“first output electrode”) of the first thin film transistor T1, an inputelectrode SE2 (hereinafter, referred to as a “second input electrode”)and an output electrode DE2 (hereinafter, referred to as a “secondoutput electrode”) of the second thin film transistor T2, and an inputelectrode SE6 (hereinafter, referred to as a “sixth input electrode”)and an output electrode DE6 (hereinafter, referred to as a “sixth outputelectrode”) of the sixth thin film transistor T6 are disposed on thesecond insulating layer 20.

The first input electrode SE1 and the first output electrode DE1 areconnected to the first semiconductor pattern OSP1 respectively through afirst contact hole CH1 and a second contact hole CH2, which are formedthrough the first and second insulating layers 10 and 20. The secondinput electrode SE2 and the second output electrode DE2 are connected tothe second semiconductor pattern OSP2 respectively through a thirdcontact hole CH3 and a fourth contact hole CH4, which are formed throughthe first and second insulating layers 10 and 20. The sixth inputelectrode SE6 and the sixth output electrode DE6 are connected to thesixth semiconductor pattern OSP6 respectively through a fifth contacthole CH5 and a sixth contact hole CH6, which are formed through thefirst and second insulating layers 10 and 20. Meanwhile, according toanother exemplary embodiment, each of the first, second, and sixth thinfilm transistors T1, T2, and T6 may have a bottom gate structure.

A third insulating layer 30 is disposed above the second insulatinglayer 20 to cover the first input electrode SE1, the second inputelectrode SE2, the sixth input electrode SE6, the first output electrodeDE1, the second output electrode DE2, and the sixth output electrodeDE6. The third insulating layer 30 includes an organic layer and/or aninorganic layer. In particular, the third insulating layer 30 mayinclude an organic material in order to provide a flat surface.

One of the first insulating layer 10, the second insulating layer 20,and the third insulating layer 30 may be omitted in accordance with thecircuit structure of the pixel. Each of the second and third insulatinglayers 20 and 30 may be referred to as an interlayer. The interlayer isdisposed between conductive patterns, e.g., upper and lower conductivepatterns, to insulate the conductive patterns from each other.

The pixel definition layer PDL and the organic light emitting diode OLEDare disposed on the third insulating layer 30. A first electrode AE isdisposed on the third insulating layer 30. The first electrode AE isconnected to the sixth output electrode DE6 through a seventh contacthole CH7 defined through the third insulating layer 30. The pixeldefinition layer PDL is provided with an opening OP definedtherethrough. At least a portion of the first electrode AE is exposedthrough the opening OP of the pixel definition layer PDL.

The pixel PX is disposed in a pixel area when viewed in a plan view. Thepixel area includes a light emitting area PXA and a non-light emittingarea NPXA adjacent to the light emitting area PXA. The non-lightemitting area NPXA surrounds the light emitting area PXA. In the presentexemplary embodiment, the light emitting area PXA is defined tocorrespond to a portion of the first electrode AE exposed through theopening OP.

A hole control layer HCL is commonly disposed in the light emitting areaPXA and the non-light emitting area NPXA. Although not shown in thefigures, a common layer, such as the hole control layer HCL, may becommonly formed in the pixels PX (refer to FIG. 4A).

An organic light emitting layer EML is disposed on the hole controllayer HCL. The organic light emitting layer EML is disposed in an areacorresponding to the opening OP. That is, the organic light emittinglayer EML may be patterned into a plurality of parts, and the parts maybe respectively disposed in the pixels PX. In the present exemplaryembodiment, the patterned organic light emitting layer EML is shown as arepresentative example, but the organic light emitting layer EML may becommonly disposed in the pixels PX. In this case, the organic lightemitting layer EML may generate a white light. In addition, the organiclight emitting layer EML may have a multi-layer structure.

An electron control layer ECL is disposed on the organic light emittinglayer EML. Although not shown in the figures, the electron control layerECL may be commonly disposed in the pixels PX (refer to FIG. 4A).

A second electrode CE is disposed on the electron control layer ECL. Thesecond electrode CE is commonly disposed in the pixels PX.

The thin film encapsulation layer TFE is disposed on the secondelectrode CE. The thin film encapsulation layer TFE is commonly disposedin the pixels PX. The thin film encapsulation layer TFE includes atleast one inorganic layer and at least one organic layer. The thin filmencapsulation layer TFE may include a plurality of inorganic layers anda plurality of organic layers alternately stacked with the inorganiclayers.

In the present exemplary embodiment, the thin film encapsulation layerTFE may directly cover the second electrode CE. In the present exemplaryembodiment, a capping layer may be further disposed between the thinfilm encapsulation layer TFE and the second electrode CE to cover thesecond electrode CE. In this case, the thin film encapsulation layer TFEmay directly cover the capping layer.

FIGS. 6A to 6C are cross-sectional views showing thin film encapsulationlayers according to an exemplary embodiment of the present disclosure.Hereinafter, the thin film encapsulation layers TFE1, TFE2, and TFE3according to the present disclosure will be described in detail withreference to FIGS. 6A to 6C.

Referring to FIG. 6A, the thin film encapsulation layer TFE1 includes ninorganic thin layers IOL1 to IOLn, and a first inorganic thin layerIOL1 among the n inorganic thin layers IOLn makes contact with thesecond electrode CE (refer to FIG. 6C). The first inorganic thin layerIOL1 may be referred to as a “lower inorganic thin layer”, and theinorganic thin layers except for the first inorganic thin layer IOL1among the n inorganic thin layers IOL1 to IOLn may be referred to as“upper inorganic thin layers”.

The thin film encapsulation layer TFE1 includes n−1 organic thin layersOL1 to OLn−1, and the n−1 organic thin layers OL1 to OLn−1 arealternately arranged with the n inorganic thin layers IOL1 to IOLn. Eachof the n−1 organic thin layers OL1 to OLn−1 may have a thickness greaterthan that of each of the n inorganic thin layers IOL1 to IOLn.

Each of the n inorganic thin layers IOL1 to IOLn may have a single-layerstructure containing one type of material or a multi-layer structurecontaining plural different types of material. Each of the n−1 organicthin layers OL1 to OLn−1 may be formed by depositing organic monomers.For instance, each of the n−1 organic thin layers OL1 to OLn−1 may beformed using an inkjet printing method or by coating a compositioncontaining an acryl-based monomer. In the present exemplary embodiment,the thin film encapsulation layer TFE1 may further include an n-thorganic thin layer.

Referring to FIGS. 6B and 6C, the inorganic thin layers included in eachof the thin film encapsulation layers TFE2 and TFE3 may include the sameinorganic material or different inorganic materials from each other andmay have the same thickness or different thicknesses. The organic thinlayers included in each of the thin film encapsulation layers TFE2 andTFE3 may include the same organic material or different organicmaterials from each other, and may have the same or differentthicknesses.

As shown in FIG. 6B, the thin film encapsulation layer TFE2 includes thefirst inorganic thin layer IOL1, the first organic thin layer OL1, thesecond inorganic thin layer IOL2, the second organic thin layer OL2, andthe third inorganic thin layer IOL3, which are sequentially stacked.

The first inorganic thin layer IOL1 may have a double-layer structure. Afirst sub-layer S1 and a second sub-layer S2 may have differentinorganic materials.

As shown in FIG. 6C, the thin film encapsulation layer TFE2 includes afirst inorganic thin layer IOL10, a first organic thin layer OL1, and asecond inorganic thin layer IOL20, which are sequentially stacked. Thefirst inorganic thin layer IOL10 may have a double-layer structure. Afirst sub-layer S10 and a second sub-layer S20 may have differentinorganic materials. The second inorganic thin layer IOL20 may have adouble-layer structure. The second inorganic thin layer IOL20 mayinclude a first sub-layer S100 and a second sub-layer S200, which aredeposited in different environments from each other. The first sub-layerS100 may be deposited at a lower power level, and the second sub-layerS200 may be deposited at high power. The first and second sub-layersS100 and S200 may include the same inorganic material.

FIG. 7A is a cross-sectional view showing a touch sensor layer accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 7A, the touch sensor layer TS includes a firstconductive layer TS-CL1, a first insulating layer (hereinafter, referredto as a “first touch insulating layer) TS-IL1, a second conductive layerTS-CL2, and a second insulating layer (hereinafter, referred to as a“second touch insulating layer) TS-IL2. The first conductive layerTS-CL1 is directly disposed on the thin film encapsulation layer TFE,but the present invention should not be limited thereto or thereby. Thatis, another inorganic layer (e.g., a buffer layer, not shown) may befurther disposed between the first conductive layer TS-CL1 and the thinfilm encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductivelayer TS-CL2 has a single-layer structure or a multi-layer structure ofplural layers stacked in the third direction DR3. The conductive layerhaving the multi-layer structure includes two or more layers amongtransparent conductive layers and metal layers. The conductive layerhaving the multi-layer structure includes metal layers including metalsthat may be different from each other. The transparent conductive layerincludes indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), indium tin zinc oxide (ITZO), PEDOT, a metal nano-wire, or agraphene. The metal layer includes molybdenum, silver, titanium, copper,aluminum, or an alloy thereof.

Each of the first conductive layer TS-CL1 and the second conductivelayer TS-CL2 includes a plurality of patterns. Hereinafter, the firstconductive layer TS-CL1 includes first conductive patterns, and thesecond conductive layer TS-CL2 includes second conductive patterns. Eachof the first and second conductive patterns includes touch electrodesand touch signal lines.

The first touch insulating layer TS-IL1 includes an inorganic materialor an organic material. The inorganic material includes at least one ofaluminum oxide, titanium oxide, silicon oxide, silicon oxynitride,zirconium oxide, and hafnium oxide. The organic material includes atleast one of an acryl-based resin, a methacryl-based resin,polyisoprene, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, and a perylene-basedresin.

The second touch insulating layer TS-IL2 has a single-layer structure ora multi-layer structure. The organic material includes at least one ofan acryl-based resin, a methacryl-based resin, polyisoprene, avinyl-based resin, an epoxy-based resin, a urethane-based resin, acellulose-based resin, a siloxane-based resin, a polyimide-based resin,a polyamide-based resin, and a perylene-based resin.

Each of the first touch insulating layer TS-IL1 and the second touchinsulating layer TS-IL2 has a single-layer structure or a multi-layerstructure. The first touch insulating layer TS-IL1 includes at least oneof an inorganic layer and an organic layer. The second touch insulatinglayer TS-IL2 includes at least one organic layer. The inorganic layerand the organic layer are formed by a chemical vapor deposition method.

The first touch insulating layer TS-IL1 should not be limited to aspecific shape if the first touch insulating layer TS-IL1 insulates thefirst conductive layer TS-CL1 and the second conductive layer TS-CL2.The shape of the first touch insulating layer TS-IL1 is determineddepending on a shape of the first and second conductive patterns. Thefirst touch insulating layer TS-IL1 entirely covers the thin filmencapsulation layer TFE or includes a plurality of insulating patterns.The insulating patterns are overlapped with first connection parts CP1and second connection parts CP2 described later.

In the present exemplary embodiment, the two-layer type touch sensorlayer has been described, but the touch sensor layer should not belimited to the two-layer type. A single-layer type touch sensor layerincludes a conductive layer and an insulating layer covering theconductive layer. The conductive layer includes touch sensors and touchsignal lines connected to the touch sensors. The single-layer type touchsensor layer obtains coordinate information using a self-capacitancemethod.

FIGS. 7B to 7E are plan views showing a touch sensor layer according toan exemplary embodiment of the present disclosure.

Referring to FIG. 7B, the touch sensor layer TS includes first touchelectrodes TE1-1 to TE1-4, first touch signal lines SL1-1 to SL1-4connected to the first touch electrodes TE1-1 to TE1-4, second touchelectrodes TE2-1 to TE2-5, second touch signal lines SL2-1 to SL2-5connected to the second touch electrodes TE2-1 to TE2-5, and a pad partPADa connected to the first touch signal lines SL1-1 to SL1-4 and thesecond touch signal lines SL2-1 to SL2-5. FIG. 7B shows the touch sensorlayer TS configured to include four first touch electrodes TE1-1 toTE1-4 and five second touch electrodes TE2-1 to TE2-5, but the number ofthe first touch electrodes and the number of the second touch electrodesshould not be limited thereto or thereby.

Each of the first touch electrodes TE1-1 to TE1-4 has a mesh shapethrough which a plurality of touch openings is defined. Each of thefirst touch electrodes TE1-1 to TE1-4 includes a plurality of firsttouch sensor parts SP1 and a plurality of first connection parts CP1.The first touch sensor parts SP1 are arranged in the first directionDR1. Each of the first connection parts CP1 connects two first touchsensor parts SP1 adjacent to each other among the first touch sensorparts SP1. Although not shown in detail, the first touch signal linesSL1-1 to SL1-4 may have a mesh shape.

The second touch electrodes TE2-1 to TE2-5 are insulated from the firsttouch electrodes TE1-1 to TE1-4 while crossing the first touchelectrodes TE1-1 to TE1-4. Each of the second touch electrodes TE2-1 toTE2-5 has a mesh shape through which a plurality of touch openings isdefined. Each of the second touch electrodes TE2-1 to TE2-5 includes aplurality of second touch sensor parts SP2 and a plurality of secondconnection parts CP2. The second touch sensor parts SP2 are arranged inthe second direction DR2. Each of the second connection parts CP2connects two second touch sensor parts SP2 adjacent to each other amongthe second touch sensor parts SP2. Although not shown in detail, thesecond touch signal lines SL2-1 to SL2-5 may have a mesh shape.

The first touch electrodes TE1-1 to TE1-4 are capacitively coupled tothe second touch electrodes TE2-1 to TE2-5. When the touch sensingsignals are applied to the first touch electrodes TE1-1 to TE1-4,capacitors are formed between the first touch sensor parts SP1 and thesecond touch sensor parts SP2.

A portion of the first touch sensor parts SP1, the first connectionparts CP1, the first touch signal lines SL1-1 to SL1-4, the second touchsensor parts SP2, the second connection parts CP2, and the second touchsignal lines SL2-1 to SL2-5 is formed by patterning the first conductivelayer TS-CL1 shown in FIG. 7A, and the other portion of the first touchsensor parts SP1, the first connection parts CP1, the first touch signallines SL1-1 to SL1-4, the second touch sensor parts SP2, the secondconnection parts CP2, and the second touch signal lines SL2-1 to SL2-5is formed by patterning the second conductive layer TS-CL2 shown in FIG.7A.

To electrically connect conductive patterns disposed on differentlayers, a contact hole may be formed through the first touch insulatinglayer TS-IL1 shown in FIG. 7A. Hereinafter, the touch sensor layer TSwill be described with reference to FIGS. 7C to 7E.

Referring to FIG. 7C, the first conductive patterns are disposed on thethin film encapsulation layer TFE. The first conductive patterns includethe second connection parts CP2. The second connection parts CP2 aredirectly disposed on the thin film encapsulation layer TFE. Referring toFIG. 7D, the first touch insulating layer TS-IL1 is disposed on the thinfilm encapsulation layer TFE to cover the second connection part CP2.Contact holes CH are defined through the first touch insulating layerTS-IL1 to partially expose the second connection part CP2. The contactholes CH are formed by a photolithography process.

Referring to FIG. 7E, the second conductive patterns are disposed on thefirst touch insulating layer TS-IL1. The second conductive patternsinclude the first touch sensor parts SP1, the first connection partsCP1, the first touch signal lines SL1-1 to SL1-4, the second touchsensor parts SP2, and the second touch signal lines SL2-1 to SL2-5.Although not shown separately, the second touch insulating layer TS-IL2is further disposed on the first touch insulating layer TS-IL1 to coverthe second conductive patterns. The second touch insulating layer TS-IL2will be described in detail later.

According to another exemplary embodiment of the present disclosure, thefirst conductive patterns include first touch electrodes TE1-1 to TE1-4and first touch signal lines SL1-1 to SL1-4. The second conductivepatterns include second touch electrodes TE2-1 to TE2-5 and second touchsignal lines SL2-1 to SL2-5. In this case, the contact holes CH are notdefined in the first touch insulating layer TS-IL1.

In addition, according to another exemplary embodiment of the presentdisclosure, the first conductive patterns and the second conductivepatterns may be changed with respect to each other. That is, the secondconductive patterns may include the second connection part CP2.

FIG. 7F is a partially enlarged view showing an area BB of FIG. 7E.

Referring to FIG. 7F, the first touch sensor part SP1 is overlapped withthe non-light emitting area NPXA. The first touch sensor part SP1includes a plurality of first extension parts SP1-A extending in a sixthdirection DR6 crossing the first and second directions DR1 and DR2 and aplurality of second extension parts SP1-B extending in a seventhdirection DR7 crossing the sixth direction DR6. The first extensionparts SP1-A and the second extension parts SP1-B may be defined as meshlines. Each mesh line has a line width of a few micrometers.

The first extension parts SP1-A are connected to the second extensionparts SP1-B to define a plurality of touch openings TS-OP. In otherwords, the first touch sensor part SP1 has a mesh shape defined by thetouch openings TS-OP. The touch openings TS-OP correspond to the lightemitting areas PXA in a one-to-one correspondence, but they should notbe limited thereto or thereby. That is, one touch opening TS-OP maycorrespond to two or more light emitting areas PXA.

The light emitting areas PXA may have various sizes. For instance, amongthe light emitting areas PXA, the size of the light emitting areas PXAemitting a blue light may be different from the size of the lightemitting areas PXA emitting a red light. Accordingly, the touch openingsTS-OP may have various sizes. In FIG. 7F, the light emitting areas PXAhave various sizes, but the light emitting areas PXA may all have thesame size, and the touch openings OP may also all have the same size.

FIGS. 8A to 8D are cross-sectional views showing display devicesaccording to exemplary embodiments of the present disclosure. For theconvenience of explanation, FIGS. 8A to 8D show the cross-sectioncorresponding to an area AA of FIG. 4B. Hereinafter, the display devicesaccording to various embodiments of the present disclosure will bedescribed in detail with reference to FIGS. 8A to 8D. In FIGS. 8A to 8D,the same reference numerals denote the same elements in FIGS. 1A to 7F,and thus, detailed descriptions of the same elements will be omitted.

Referring to FIGS. 8A to 8D, a display device includes a base memberBSM, a circuit layer DP-CL, a display layer DP-OLED, a thin filmencapsulation layer TFE, and a touch sensor layer TS.

The base member BSM includes a first area AR1 and a second area AR2. Thefirst area AR1 includes a first sub-area AR1-1 and a second sub-areaAR1-2. The first area AR1 includes a display area and a non-displayarea. The first sub-area AR1-1 corresponds to the display area. Thesecond sub-area AR1-2 corresponds to the first non-display area. Thesecond area AR2 corresponds to the second non-display area. The secondarea AR2 may correspond to an outermost area of the display device.

The base member BSM includes a base layer SUB and a buffer layer BFL.

The base layer SUB may be a flexible substrate and may include a plasticsubstrate, a glass substrate, a metal substrate, or anorganic/inorganic-mixed material substrate. The plastic substrateincludes at least one of an acryl-based resin, a methacryl-based resin,polyisoprene, a vinyl-based resin, an epoxy-based resin, aurethane-based resin, a cellulose-based resin, a siloxane-based resin, apolyimide-based resin, a polyamide-based resin, and a perylene-basedresin. The buffer layer BFL includes an inorganic material. The bufferlayer BFL may include silicon oxide or silicon nitride.

In FIGS. 8A to 8D, the buffer layer BFL is disposed on the base layerSUB as a functional layer, but a barrier layer may be disposed as thefunctional layer. According to another exemplary embodiment, the bufferlayer BFL may be omitted from the display device.

In FIGS. 8A to 8D, the second area AR2 has a flat shape, but the secondarea AR2 may be curved at a constant curvature in the third directionDR3.

The circuit layer DP-CL is disposed on the base member BSM. The circuitlayer DP-CL covers the first area AR1 and exposes the second area AR2.The circuit layer DP-CL covers the first sub-area AR1-1 and the secondsub-area AR1-2. The circuit layer DP-CL exposes the second area AR2.

The circuit layer DP-CL includes a thin film transistor TR, conductivelines E-VSS and CL, and at least one insulating layer.

A semiconductor pattern OSP of the thin film transistor TR is disposedon the base layer SUB. The semiconductor pattern OSP includes amorphoussilicon, polysilicon, or metal oxide semiconductor. The insulating layerincludes a first insulating layer 10 and a second insulating layer 20.An end of the first insulating layer 10 and an end of the secondinsulating layer 20 are aligned parallel to each other. In other words,one end of the first insulating layer 10 and one end of the secondinsulating layer 20 are disposed adjacent to an outer portion of thedisplay device. An end of the circuit layer DP-CL is defined by the endof the insulating layer disposed at an outermost position among the endof the first insulating layer 10 and the end of the second insulatinglayer 20. The end of the insulating layer defines a boundary between thefirst area AR1 and a second area AR2. The end of the insulating layerdefines ends of the second sub-area AR1-2 and the second area AR2.

The first insulating layer 10 is disposed above the base layer SUB tocover the semiconductor pattern OSP. The first insulating layer 10includes an organic layer and/or an inorganic layer. The firstinsulating layer 10 includes a plurality of inorganic thin layers. Theinorganic thin layers include a silicon nitride layer and a siliconoxide layer.

A control electrode GE of the thin film transistor TR is disposed on thefirst insulating layer 10. The control electrode GE is formed throughthe same photolithography process as the gate lines GL (refer to FIG.4A). The control electrode GE includes the same material and the samestack structure as those of the gate lines, and is disposed on the samelayer.

The second insulating layer 20 is disposed on the first insulating layer10 to cover the control electrode GE. The second insulating layer 20includes an organic layer and/or an inorganic layer. The secondinsulating layer 20 includes a plurality of inorganic thin layers. Theinorganic thin layers include a silicon nitride layer and a siliconoxide layer. The second insulating layer 20 includes a materialdifferent from that of the first insulating layer 10.

An input electrode SE and an output electrode DE of the thin filmtransistor TR are disposed on the second insulating layer 20. The signallines CL and the power supply line E-VSS are disposed on the secondinsulating layer 20.

A first dam part DM1 and a second dam part DM2 are disposed in thesecond sub-area AR1-2. The first and second dam parts DM1 and DM2 aredisposed to surround the first sub-area AR1-1 when viewed in a planview. When the organic monomer is printed to form the organic thin layerOL1 of the thin film encapsulation layer TFE, the first and second damparts DM1 and DM2 may prevent the organic monomer from overflowing.

The first dam part DM1 is disposed on the power supply line E-VSS. Thefirst dam part DM1 has a single-layer structure and is substantiallysimultaneously formed with the pixel definition layer PDL.

The second dam part DM2 is disposed outside the first dam part DM1. Forinstance, a distance between the second dam part DM2 and the firstsub-area AR1-1 is greater than a distance between the first dam part DM1and the first sub-area AR1-1.

The second dam part DM2 covers a portion of the power supply line E-VSS.The second dam part DM2 includes a plurality of layers, e.g., a firstlayer DM2-L1 and a second layer DM2-L2.

A third insulating layer 30 is disposed on the second insulating layer20 to cover the input electrode SE and the output electrode DE. Thethird insulating layer 30 includes an organic layer and/or an inorganiclayer. The third insulating layer 30 includes an organic material toprovide a flat surface.

One of the first insulating layer 10, the second insulating layer 20,and the third insulating layer 30 may be omitted in accordance with thecircuit structure of the pixel. Each of the second and third insulatinglayers 20 and 30 may be referred to as an “interlayer”. The interlayeris disposed between conductive patterns, e.g., upper and lowerconductive patterns, to insulate the conductive patterns from eachother.

The display layer DP-OLED is disposed on the third insulating layer 30.The pixel definition layer PDL and the organic light emitting diode OLEDare disposed on the third insulating layer 30. A first electrode AE isdisposed on the third insulating layer 30. The first electrode AE isconnected to the output electrode DE through a contact hole definedthrough the third insulating layer 30. A light emitting area is definedin the pixel definition layer PDL. At least a portion of the firstelectrode AE is exposed through the light emitting area of the pixeldefinition layer PDL.

A light emitting unit EU is disposed on the first electrode AE. A secondelectrode CE is disposed on the light emitting unit EU. Although notshown in figures, the light emitting unit EU may include a hole controllayer HCL, an organic light emitting layer EML, and an electron controllayer ECL as shown in FIG. 5C.

A connection electrode E-CNT is disposed on the same layer as the firstelectrode AE. The first electrode AE and the connection electrode E-CNTare disposed on the third insulating layer 30. The first electrode AEand the connection electrode E-CNT are formed through the same process.The connection electrode E-CNT is electrically connected to the powersupply line E-VSS. The connection electrode E-CNT receives the secondvoltage ELVSS (refer to FIG. 5A) from the power supply line E-VSS.Although not shown in the figures, the connection electrode E-CNT isdisposed to partially overlap with a first layer DM2-L1 of the seconddam part DM2.

In the present exemplary embodiment, the thin film encapsulation layerTFE directly covers the second electrode CE. In the present exemplaryembodiment, a capping layer may be further disposed to cover the secondelectrode CE. In this case, the thin film encapsulation layer TFEdirectly covers the capping layer. The thin film encapsulation layer TFEincludes a first inorganic thin layer IOL10, a first organic thin layerOL1, and a second inorganic thin layer IOL20, which are sequentiallystacked, but it should not be limited thereto or thereby. The thin filmencapsulation layer TFE may include a plurality of inorganic thin layersand a plurality of organic thin layers.

An end of the thin film encapsulation layer TFE is disposed on the firstarea AR1. The end of the thin film encapsulation layer TFE is disposedto be closer to a center of the display device than the ends of thefirst and second insulating layers 10, 20.

The touch sensor layer TS is disposed on the thin film encapsulationlayer TFE. The touch sensor layer TS includes the first touch insulatinglayer TS-IL1, a plurality of conductive patterns disposed on the firsttouch insulating layer TS-IL1, and the second touch insulating layerTS-IL2 disposed on the conductive patterns. The conductive patternsinclude touch sensor parts SP disposed in the first sub-area AR1-1 andthe touch signal lines SL disposed in the second sub-area AR1-2.

The touch sensor parts SP correspond to the first touch sensor parts SP1and the second touch sensor parts SP2 shown in FIGS. 7A to 7F, and thetouch signal lines SL correspond to the first touch signal lines SL1-1to SL1-4 and the second touch signal lines SL2-1 to SL2-5 shown in FIGS.7A and 7F. Although not shown in the figures, the conductive patternsmay further include patterns disposed between the first touch insulatinglayer TS-IL1 and the thin film encapsulation layer TFE. Hereinafter,duplicated explanation with respect to the touch sensor parts SP and thetouch signal lines SL will be omitted.

An end of the first touch insulating layer TS-IL1 is disposed in thefirst area AR1. The end of the first touch insulating layer TS-IL1 isdisposed in the second sub-area AR1-2. The end of the first touchinsulating layer TS-IL1 is aligned to be parallel to the end of the thinfilm encapsulation layer TFE. The end of the first touch insulatinglayer TS-IL1 is disposed to be closer to the center of the displaydevice than the ends of the first and second insulating layers 10 and20.

The second touch insulating layer TS-IL2 includes an organic material.Hereinafter, for the convenience of explanation, the second touchinsulating layer TS-IL2 is referred to as an “organic layer”. Theorganic layer TS-IL2 is overlapped with the first sub-area AR1-1 and thesecond sub-area AR1-2. The organic layer TS-IL2 is overlapped with atleast a portion of the second area AR2. The organic layer TS-IL2 coversthe second area AR2. The organic layer TS-IL2 is disposed to directlymake contact with an upper portion of the touch sensor layer TS. Theorganic layer TS-IL2 directly makes contact with and covers the firsttouch insulating layer TS-IL1 and the conductive patterns disposed onthe first touch insulating layer TS-IL1. The organic layer TS-IL2 makescontact with a portion of the first touch insulating layer TS-IL1 andcovers the touch sensor parts SP and the touch signal lines SL, whichare disposed on the first touch insulating layer TS-IL1.

The organic layer TS-IL2 is overlapped with an entire surface of theinsulation layer. The organic layer TS-IL2 is entirely overlapped withthe first insulating layer 10 and the second insulating layer 20. Theorganic layer TS-IL2 is entirely overlapped with the second area AR2when viewed in a plan view as shown in FIG. 8A to cover the end of thedisplay device. As another example, the organic layer TS-IL2 may beoverlapped with a portion of the second area AR2 when viewed in a planview, as shown in FIGS. 8B to 8D. The organic layer TS-IL2 may bedisposed to cover the ends of the thin film encapsulation layer TFE andthe touch sensor layer TS.

Although not shown in the figures, the pad parts PD (refer to FIG. 4A)and the control signal line SL-D (refer to FIG. 4A) may be disposed inthe area shown in FIGS. 8A to 8D and the other area of an outermostportion of the display panel DP. The pad parts PD are disposed tooverlap with the second area AR2. In this case, the organic layer TS-IL2may be disposed not to overlap with the pad parts PD. The organic layerTS-IL2 may expose the pad parts PD. The exposed pad parts PD may beeasily and electrically connected to an external electrical component.

Referring to FIG. 8B, a display device may further include ashock-absorbing member disposed on the second area of the base layerSUB. The shock-absorbing member is disposed on the second area AR2 ofthe base layer SUB. The shock-absorbing member includes a plurality ofinsulating patterns DM-CP. The shock-absorbing member absorbs shocksgenerated outside the display device to prevent a fracture fromoccurring in the insulating layer.

The insulating patterns DM-CP are arranged in the first direction DR1and spaced apart from each other. In the present exemplary embodiment, abending axis of the second area AR2 is defined along the seconddirection DR2. The insulating patterns DM-CP are spaced apart from eachother in the first direction DR1 and extend in the second direction DR2.The insulating patterns DM-CP extend in a direction parallel to thebending axis and are spaced apart from each other in a directioncrossing the bending axis, and thus an influence exerting on the displaydevice by the insulating patterns DM-CP may be reduced.

The organic layer TS-IL2 covers a side surface and an upper surface ofthe shock-absorbing member. The organic layer TS-IL2 covers eachinsulating pattern DM-CP of the shock-absorbing member. A space isdefined between the insulating patterns DM-CP. The insulating patternsDM-CP are spaced apart from each other at regular intervals, but theinterval between the insulating patterns DM-CP may not be constant. Theorganic layer TS-IL2 may fill in the spaces between the insulatingpatterns DM-CP. The organic layer TS-IL2 has a thickness equal to orgreater than the insulating patterns DM-CP to entirely cover theinsulating patterns DM-CP.

Each of the insulating patterns DM-CP includes a first layer DM-C1 and asecond layer DM-C2. The first and second layers DM-C1 and CM-C2 aresequentially stacked. The first layer DM-C1 has the same thickness asthat of the first insulating layer 10. The second layer DM-C2 has thesame thickness as that of the second insulating layer 20.

The insulating patterns DM-CP include the same material as that of thefirst and second insulating layers 10, 20. The first layer DM-C1includes the same material as that of the first insulating layer 10. Thesecond layer DM-C2 includes the same material as that of the secondinsulating layer 20. The first layer DM-C1 is formed through the sameprocess as the first insulating layer 10, and the second layer DM-C2 isformed through the same process as the second insulating layer 20.

Referring to FIG. 8C, the shock-absorbing member DM-C may furtherinclude a cover member DM-CC covering the insulating patterns DM-CP. Thecover member DM-CC covers the entire surface of the insulating patternsDM-CP to prevent foreign substances from contacting the insulatingpatterns DM-CP. The cover member DM-CC is overlapped with the secondarea. The cover member DM-CC is partially overlapped with the firstarea. The cover member DM-CC is partially overlapped with the secondsub-area AR1-2.

The organic layer TS-IL2 covers a side surface and an upper surface ofthe cover member DM-CC. Since the organic layer TS-IL2 covers the sidesurface and the upper surface of the cover member DM-CC, the organiclayer TS-IL2 may completely cover the shock-absorbing member DM-Cwithout exposing the shock-absorbing member DM-C.

Referring to FIG. 8D, a buffer layer BFL of a display device accordingto the present exemplary embodiment includes a first buffer part BFL-Aand a second buffer part BFL-B. The first buffer part BFL-A is spacedapart from the second buffer part BFL-B. At least one opening BFL-OP isdefined between the first buffer part BFL-A and the second buffer partBFL-B.

The first buffer part BFL-A is disposed in the second area AR2. Thefirst buffer part BFL-A is overlapped with the second area AR2. Theopening BFL-OP is defined in the second area AR2. The opening BFL-OP hasa predetermined width in the first direction DR1 and extends in thesecond direction DR2.

The organic layer TS-IL2 is filled in the opening BFL-OP. Since theorganic layer TS-IL2 is filled in the opening BFL-OP, the organic layerTS-IL2 covers exposed side surfaces of the first and second buffer partsBFL-A and BFL-B.

The organic layer TS-IL2 according to the present exemplary embodimentcovers components causing a step difference on the base member BSM.Accordingly, the organic layer TS-IL2 covers an end of the circuit layerDP-CL, which causes the step difference on the base member BSM, as shownin FIG. 8A, and covers the shock-absorbing member DM-C as shown in FIGS.8B and 8C. In addition, the organic layer TS-IL2 cover the openingBFL-OP defined through the base member BSM as shown in FIG. 8D, andthus, the concave step difference may be covered.

In the present exemplary embodiment, the organic layer TS-IL2 disposedon the touch sensor layer TS covers the second area AR2, which is theoutermost portion of the display module DM, and thus, a fracture may beprevented from occurring in the outer portion. In particular, in thecase that the shock-absorbing member DM-C is disposed in the second areaAR2 or the opening BFL-OP of the buffer layer BFL is defined in thesecond area AR2, the organic layer TS-IL2 covers the shock-absorbingmember CM-C or is filled in the opening BFL-OP to relieve a stressgenerated upon bending the display device, and thus, the fracture may beprevented from occurring in the outer portion.

Hereinafter, a method of manufacturing the display device will bedescribed in detail.

FIGS. 9A to 9I are cross-sectional views showing a method ofmanufacturing a display module shown in FIG. 8C.

Referring to FIGS. 9A and 9B, the base layer SUB is prepared. Thefunctional layers, such as the buffer layer BFL, may be further disposedon the one surface of the base layer SUB. At least the semiconductorpattern OSP is formed on the base layer SUB, and the first insulatinglayer 10 is formed on the base layer SUB to cover the semiconductorpattern OSP.

Referring to FIG. 9C, the control electrode GE is formed on the firstinsulating layer 10. The control electrode GE is formed to be disposedon the semiconductor pattern OSP. The control electrode GE is formed bya photolithography process. The second insulating layer 20 is formed tocover the control electrode GE formed on the first insulating layer 10.The end of the first insulating layer 10 and the end of the secondinsulating layer 20 are aligned parallel to each other. As anotherexample, each of the first and second insulating layers 10 and 20 may beformed to entirely overlap with the base layer SUB.

Referring to FIG. 9D, the manufacturing method of the display deviceincludes etching portions of the first and second insulating layers 10and 20. In the etching process, outer portions of the first and secondinsulating layers 10 and 20 are partially etched to form the insulatingpatterns DM-CP. The insulating patterns DM-CP include the first layerDM-C1 and the second layer DM-C2. The first layer DM-C1 is formed byetching the portion of the first insulating layer 10, and the secondlayer DM-C2 is formed by etching the portion of the second insulatinglayer 20. In the etching process, a thru-hole TH1 is formed by etchingthe first and second insulating layers 10 and 20 to expose a portion ofthe semiconductor pattern OSP. The insulating patterns DM-CP may besubstantially simultaneously formed using one mask together with thefirst and second insulating layers 10 and 20 forming the circuit layerDP-CL. Thus, a manufacturing time may be shortened, and a manufacturingcost may be reduced.

Referring to FIG. 9E, the output electrode DE, the input electrode SE,the signal lines CL, and the power supply line E-VSS are formed on thesecond insulating layer 20. The third insulating layer 30 is formedabove the second insulating layer 20 to cover the thin film transistorTR and the signal lines CL. The third insulating layer 30 is formed toentirely overlap with the first and second insulating layers 10 and 20and patterned. In this case, the first layer DM2-L1 of the second dampart DM2 (refer to FIG. 8C) and the cover member DM-CC of theshock-absorbing member DM-C may be formed. The first layer DM2-L1 of thesecond dam part is formed to overlap with a portion of the power supplyline E-VSS. The third insulating layer 30, the first layer DM2-L1 of thesecond dam part, and the cover member DM-CC include the same material.In the etching process, a thru-hole TH2 is formed through the thirdinsulating layer 30 to expose a portion of the input electrode SE.

Referring to FIG. 9F, the first electrode AE connected to one of theoutput electrodes DE and the connection electrode E-CNT are formed. Thefirst electrode AE and the connection electrode E-CNT are formed on thesame layer. The first electrode AE and the connection electrode E-CNTare formed on the third insulating layer 30. The first electrode AE isconnected to the thin film transistor TR through the third insulatinglayer 30.

The connection electrode E-CNT is electrically connected to the powersupply line E-VSS. The connection electrode E-CNT receives the secondvoltage ELVSS (refer to FIG. 5A) from the power supply line E-VSS.Although not shown in figures, the connection electrode E-CNT is formedto be partially disposed on the first layer DM2-L1 of the second dampart DM2.

The light emitting unit EU, the pixel definition layer PDL, and thesecond electrode CE are formed on the third insulating layer 30. Thelight emitting unit EU is formed between the first electrode AE and thesecond electrode CE. In the process of forming the pixel definitionlayer PDL, the first dam part DM1 overlapped with the power supply lineE-VSS and the second layer DM2-L2 overlapped with the first layer DM2-L1of the second dam part DM2 are formed. The pixel definition layer PDL,the first dam part DM1, and the second layer DM2-L2 may be formedthrough the same material and may include the same material.

Referring to FIG. 9G, the thin film encapsulation layer TFE is formed onthe display layer DP-OLED. The thin film encapsulation layer TFE isformed by sequentially forming the first inorganic thin layer IOL10, thefirst organic thin layer OL1, and the second inorganic thin layer IOL20.The first organic thin layer OL1 is formed by providing a liquid organicmonomer on the first inorganic thin layer IOL10. The organic monomerdoes not flow over the first and second dam parts DM1 and DM2 by thefirst and second dam parts DM1 and DM2, and thus, the organic monomer isstably formed to have a predetermined thickness.

Referring to FIG. 9H, the first touch insulating layer TS-IL1 and theconductive patterns are formed on the thin film encapsulation layer TFE.The first touch insulating layer TS-IL1 is formed on the thin filmencapsulation layer TFE, and the signal lines SL and the touch sensorparts SP are formed on the first touch insulating layer TS-IL1. Thetouch sensor parts SP are formed on the first sub-area AR1-1, and thesignal lines SL are formed on the second sub-area AR1-2.

Referring to FIG. 9I, the organic layer TS-IL2 is formed on the firsttouch insulating layer TS-IL1. The organic layer TS-IL2 is formed on thefirst touch insulating layer TS-IL1 to entirely cover the conductivepatterns.

The organic layer TS-IL2 is formed to entirely overlap with the firstinsulating layer 10 and the second insulating layer 20. The organiclayer TS-IL2 is formed to overlap with the first sub-area AR1-1, thesecond sub-area AR1-2, and the second area AR2.

The organic layer TS-IL2 is formed to cover the shock-absorbing memberDM-C formed on the second area AR2. The organic layer TS-IL2 entirelycovers the circuit layer DP-CL and extends from the touch sensor layerTS to cover the side surface and the upper surface of theshock-absorbing member DM-C. As described above, since the organic layerTS-IL2 covers the shock-absorbing member DM-C, which is disposed at theoutermost position and causes the step difference on the base memberBSM, the stress generated upon bending the display device may berelieved. Thus, fractures may be prevented from occurring in the outerportion.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concept is not limitedto such embodiments, but rather to the broader scope of the presentedclaims and various obvious modifications and equivalent arrangements.

What is claimed is:
 1. A display device comprising: a base member; acircuit layer disposed on the base member; a display layer disposed onthe circuit layer and comprising an organic light emitting diode; a thinfilm encapsulation layer disposed on the display layer and comprising afirst inorganic thin film, an organic thin film, and a second inorganicthin film sequentially stacked; and a touch sensor layer disposeddirectly on the thin film encapsulation layer, wherein: the touch sensorlayer comprises a first conductive layer disposed on the thin filmencapsulation layer, a first insulating layer disposed on the firstconductive layer, a second conductive layer disposed on the firstinsulating layer, and a second insulating layer disposed on the secondconductive layer; a first region overlapping the circuit layer and asecond region non-overlapping the circuit layer are defined in the basemember; the second insulating layer overlaps the first region andextends to cover at least a portion of the second region of the basemember; and the second insulating layer directly contacts a portion ofthe thin film encapsulation layer and a portion of the circuit layer. 2.The display device of claim 1, wherein: the touch sensor layer furthercomprises an inorganic insulating layer disposed between the firstconductive layer and the thin film encapsulation layer; and theinorganic insulating layer directly contacts the thin film encapsulationlayer.
 3. The display device of claim 1, wherein a boundary between thefirst region and the second region is defined by an end of the circuitlayer.
 4. The display device of claim 1, wherein an end of the circuitlayer protrudes further than an end of the thin film encapsulationlayer, and a portion of the circuit layer not covered by the thin filmencapsulation layer contacts the second insulating layer.
 5. The displaydevice of claim 1, wherein an end of the first insulating layer isaligned with an end of the thin film encapsulation layer.
 6. The displaydevice of claim 1, wherein the first insulating layer is an inorganiclayer, and the second insulating layer is an organic layer.
 7. Thedisplay device of claim 1, further comprising a shock absorbing memberdisposed on the second region of the base member, wherein the shockabsorbing member comprises patterns spaced apart from each other.
 8. Thedisplay device of claim 7, wherein the second insulating layer coversall of the patterns.
 9. The display device of claim 7, wherein the shockabsorbing member further comprises a cover member covering all of thepatterns, and the second insulating layer completely covers the covermember.
 10. The display device of claim 7, wherein the patterns arespaced apart from the circuit layer.
 11. The display device of claim 7,wherein a thickness of the second insulating layer is greater than athickness of each of the patterns.
 12. A display device comprising: abase member; a circuit layer disposed on the base member; a displaylayer disposed on the circuit layer and comprising an organic lightemitting diode; a thin film encapsulation layer disposed on the displaylayer and comprising a first inorganic thin film, an organic thin film,and a second inorganic thin film sequentially stacked; and a touchsensor layer disposed directly on the thin film encapsulation layer,wherein: the touch sensor layer comprises a first conductive layerdisposed on the thin film encapsulation layer, a first insulating layerdisposed on the first conductive layer, a second conductive layerdisposed on the first insulating layer, and a second insulating layerdisposed on the second conductive layer; a first region overlapping thecircuit layer and a second region non-overlapping the circuit layer aredefined in the base member; the second insulating layer overlaps thefirst region and extends to cover at least a portion of the secondregion of the base member; and a bottom surface of the second insulatinglayer is not even.
 13. The display device of claim 12, wherein thebottom surface of the second insulating layer directly contacts a topsurface of a portion of the circuit layer.
 14. The display device ofclaim 13, wherein: the portion of the circuit layer is not covered bythe thin film encapsulation layer; and the second insulating layerextends further than an end of the thin film encapsulation layer. 15.The display device of claim 12, further comprising a shock absorbingmember disposed on the second region of the base member, wherein theshock absorbing member comprises patterns spaced apart from each other.16. The display device of claim 15, wherein the second insulating layercovers all of the patterns.
 17. The display device of claim 15, whereinthe shock absorbing member further comprises a cover member covering allof the patterns, and the second insulating layer completely covers thecover member.
 18. The display device of claim 12, wherein the secondinsulating layer is an organic layer.